On March 16th, at the forum of "Innovation and Cooperation of Advanced packaging Materials in the Post-Moore Era" held in the sealing and Dating meeting, Chen Xianming, CEO of Zhuhai Yueya Semiconductor Co., LTD., delivered a speech titled "The urgency of high-end IC sealing and loading plate supply and domestic replacement".

Chen Xianming believes that the current global semiconductor industry is in a golden decade of rapid growth, this round of semiconductor cycle driven by analog chips and digital chips. For China's semiconductor industry chain, there is also a significant opportunity for domestic substitution.

He pointed out that the domestic packaging and testing industry has been to catch up with the international counterparts of the confidence and strength, but at the same time should also see that the IC packaging plate has become a weak link in China's semiconductor industry chain. In addition, with the development of advanced packaging in the post-Moore era, the process consistency and other performance of IC seal loading plate are also put forward higher requirements.

Chen Xianming said that due to the development of IC sealing plate in the domestic for a long time in the neglected situation, once the external supply chain fluctuations, on China's IC board and even on the development of China's semiconductor industry will bring impact, so it is urgent to fill the short board.

At present, the field of the original participants are increased gradually in the high-end product expansion continues, such as zhuhai is in radio frequency and power management module, niche markets such as the required sealing load board, has become the world's major suppliers, and in June last year to achieve FCBGA loading plate production, to provide domestic digital chip testing company solution.

Chen Xianming also mentioned that from foreign experience, PCB substrate and IC carrier supply chain often has a high degree of integration, but in China because the latter needs a longer period of technology cultivation, and quite a long time demand is not prosperous, resulting in the domestic PCB industry chain attention. With the change of macro environment, PCB substrate manufacturers are gradually entering the IC carrier board market, but due to the lack of mass production process and engineering experience, it will take time to form an effective capacity.

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