According to Nanfang Daily, Zhuhai Yuexin Semiconductor Co., Ltd. plans to be ready for production in July this year.

On December 8 LAST YEAR, ZHUHAI YUEXIN SEMICONDUCTOR CO., LTD., LAID THE FOUNDATION OF THE HIGH-END RF AND FCBGA SEALING AND LOADING PLATE MANUFACTURING PROJECT. On January 28 this year, Zhuhai Yueche B1 plant held a capping ceremony, 50 days to achieve the first plant capping. In addition, the second plant was capped in 90 days.

The PUBLIC INFORMATION AT the time of the foundation of the project shows that ZHUHAI Yuexin Semiconductor Co., LTD., which is leading the project, is a wholly owned SUBSIDIARY of ZHUHAI Yueya SEMICONDUCTOR Co., LTD. Zhuhai Yue CHIP Project consists of two large plots, with a total area of 88,000 square meters, and Vietnam Asia 3.5 billion capital increase project officially settled here. The project will expand the production and manufacturing projects of high-end RF and FCBGA sealing and loading plates, further expand the production scale of high-end RF and FCBGA sealing and loading plates, and form industrial collaboration with the existing products of Vietnam Asia.

It is understood that the core project of postpartum, zhuhai is the three factory specializes in manufacturing separately, reinforcing China's semiconductor on the load board packaging materials of short and weak, keep more in zhuhai radio frequency sealing loading plate on the market of the world's first, buried closure loading plate embedded industry first, FCBGA loading plate the advantage of the first.

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