Following the capping of B1 plant of the third plant of VietAsia Semiconductor Co., LTD., on January 28, A1 plant, another main plant of the project, was also successfully capped 90 days after the start of construction on March 8. The capping of the two main factory buildings means that Zhuhai Cross core has officially entered the internal installation stage.

The project plans to double the production capacity of Via Post, which is used to seal loading boards for chips such as 4G/5G radio frequency chips, and FCBGA, which is used to seal loading boards for mid - and high-end digital chips, by July this year, in order to quickly meet the urgent needs of domestic and foreign customers in technology and capacity in 2022.

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Future with the integration of the industry in a new round of 5 g, cloud computing, Internet of things, such as under the growth of demand, the three main products of semiconductor - Via the Post loading board, embedded buried copper column, loading plate, FCBGA closure loading plate respectively in three factory mutual support and backup, mass production to the customer and the rapid increment of semiconductor supply chain.

With the support of customers and suppliers from all walks of life in different markets, and with the support of national policies and governments at all levels, VietAsia will usher in new development opportunities and contribute its strength to the realization of autonomous and controllable semiconductor supply chain in China and the growth demand of relevant segments of the international semiconductor supply chain.

 Source URL：https://mp.weixin.qq.com/s/Q4YwlHZAVPRcvrQkOEZf7A